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| INTEGRATED CIRCUITS DATA SHEET TDA7052B Mono BTL audio amplifier with DC volume control Product specification Supersedes data of 1966 May 28 File under Integrated Circuits, IC01 1997 Aug 15 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control FEATURES * DC volume control * Few external components * Mute mode * Thermal protection * Short-circuit proof * No switch-on and switch-off clicks * Good overall stability * Low power consumption * Low HF radiation * ESD protected on all pins. QUICK REFERENCE DATA SYMBOL VP PO PARAMETERS supply voltage output power TDA7052B TDA7052BT Gv(max) Iq(tot) THD maximum total voltage gain gain control total quiescent current total harmonic distortion TDA7052B TDA7052BT ORDERING INFORMATION TYPE NUMBER TDA7052B TDA7052BT PACKAGE NAME DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm PO = 0.5 W PO = 0.25 W - - 0.3 0.3 VP = 6 V; RL = VP = 6 V RL = 8 RL = 16 0.9 0.5 39.5 68 - 1.0 0.55 40.5 73.5 9.2 CONDITIONS MIN. 4.5 - TYP. GENERAL DESCRIPTION TDA7052B The TDA7052B and TDA7052BT are 1 W and 0.5 W mono Bridge-Tied Load (BTL) output amplifiers with DC volume control. They have been designed for use in TV and monitors, but are also suitable for use in battery-fed portable recorders and radios. A Missing Current Limiter (MCL) is built in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (300 mA typ.). This level of 100 mA allows for headphone applications (single-ended). MAX. 18 - - 41.5 - 13 1 1 UNIT V W W dB dB mA % % VERSION SOT97-1 SOT96-1 1997 Aug 15 2 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control BLOCK DIAGRAM TDA7052B VP handbook, full pagewidth 1 n.c. 7 TDA7052B TDA7052BT input DC volume control 2 4 I+i 5 positive output I -i 8 negative output STABILIZER Vref TEMPERATURE PROTECTION 3 6 MSA705 - 1 signal ground power ground Fig.1 Block diagram. PINNING SYMBOL VP IN+ GND1 VC OUT+ GND2 n.c. OUT- PIN 1 2 3 4 5 6 7 8 input signal ground DC volume control positive output power ground not connected negative output DESCRIPTION supply voltage handbook, halfpage VP IN GND1 VC 1 2 3 4 MSA704 - 1 8 OUT n.c. GND2 OUT TDA7052B TDA7052BT 7 6 5 Fig.2 Pin configuration. 1997 Aug 15 3 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control FUNCTIONAL DESCRIPTION The TDA7052B and TDA7052BT are mono BTL output amplifiers with DC volume control which have been designed for use in TV and monitors but are also suitable for use in battery-fed portable recorders and radios. In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitors to keep the offset voltage low. In the TDA7052B and TDA7052BT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required. With this configuration, a low offset voltage is maintained and the minimum supply voltage remains low. The BTL principle offers the following advantages: * Lower peak value of the supply current * The frequency of the ripple on the supply voltage is twice the signal frequency. Consequently, a reduced power supply with smaller capacitors can be used which results in cost reductions. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power. TDA7052B The maximum gain of the amplifier is fixed at 40.5 dB. The DC volume control stage has a logarithmic control characteristic. Therefore, the total gain can be controlled from 40.5 dB to -33 dB. If the DC volume control voltage falls below 0.4 V, the device will switch to the mute mode. The amplifier is short-circuit proof to ground, VP and across the load. Also a thermal protection circuit is implemented. If the crystal temperature rises above +150 C the gain will be reduced, thereby reducing the output power. Special attention is given to switch-on and switch-off clicks, low HF radiation and a good overall stability. Power dissipation Assume for the TDA7052B that VP = 6 V; RL = 8 . The maximum sine wave dissipation is 0.9 W. The Rth j-a of the package is 100 K/W. Therefore Tamb(max) = 150 - 100 x 0.9 = 60 C. Assume for the TDA7052BT that VP = 6 V; RL = 16 . The maximum sine wave dissipation is 0.46 W. The Rth j-a of the package is 155 K/W. Therefore Tamb(max) = 150 - 155 x 0.46 = 78 C. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP V2, 4 IORM IOSM Ptot supply voltage input voltage pins 2 and 4 repetitive peak output current non-repetitive peak output current total power dissipation TDA7052B TDA7052BT Tamb Tstg Tvj Tsc operating ambient temperature storage temperature virtual junction temperature short-circuit time Tamb 25 C - - -40 -55 - - 1.25 0.8 +85 +150 +150 1 W W C C C h PARAMETER CONDITIONS - - - - MIN. 18 5 1.25 1.5 MAX. V V A A UNIT THERMAL CHARACTERISTICS SYMBOL Rth j-a TDA7052B TDA7052BT 1997 Aug 15 4 PARAMETER thermal resistance from junction to ambient in free air 100 155 K/W K/W VALUE UNIT Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control CHARACTERISTICS VP = 6 V; VDC = 1.4 V; f = 1 kHz; RL = 8 ; Tamb = 25 C; unless otherwise specified (see Fig.13). SYMBOL Supply VP Iq(tot) supply voltage total quiescent current note 1; RL = 4.5 - - 9.2 PARAMETER CONDITIONS MIN. TYP. TDA7052B MAX. UNIT 18 13 V mA Maximum gain (V4 = 1.4 V) PO output power TDA7052B TDA7052BT THD total harmonic distortion TDA7052B TDA7052BT Gv(max) VI Vno B SVRR VO ZI VO maximum total voltage gain input signal handling (RMS value) Gv(max) = 0 dB; THD < 1% noise output voltage (RMS value) bandwidth supply voltage ripple rejection DC output offset voltage input impedance (pin 3) note 4; V4 0.4 V; VI = 1.0 V note 2; f = 500 kHz at -1 dB note 3 V8 - V5 PO = 0.5 W PO = 0.25 W - - 39.5 1.0 - - 48 - 15 - 0.3 0.3 40.5 - 210 60 0 20 - 1 1 41.5 - - - 200 25 % % dB V V kHz dB mV k V THD = 10% 0.9 0.5 1.0 0.55 - - W W 0.02 to 300 - Mute position output voltage in mute position 30 DC volume control; note 5 I4 Notes 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz. 3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV (RMS value) is applied to the positive supply rail. 4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted. 5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15. The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage gain. gain control control current V4 = 0 V 68 -20 73.5 -25 - -30 dB A 1997 Aug 15 5 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control TDA7052B MBH372 handbook, halfpage 40 handbook, halfpage 1 MBH373 Gv (dB) 0 Vno (mV) -40 10-1 -80 -120 10-2 0 0.4 0.8 1.2 1.6 2.0 VDC (V) 0 0.4 0.8 1.2 1.6 2.0 VDC (V) Measured with RS = 5 k unweighted. Frequency range is 22 Hz to 22 kHz. Fig.3 Gain control as a function of DC volume control. Fig.4 Noise output voltage as a function of DC volume control. handbook, halfpage 25 MBH376 IDC (A) handbook, halfpage 20 MBH367 15 IP (mA) 15 5 -5 10 -15 -25 0 0.4 0.8 1.2 1.6 2.0 VDC (V) 5 0 4 8 12 16 VP (V) 20 Fig.5 Control current as a function of DC volume control. Measured with RL = . Fig.6 Quiescent current versus supply voltage. 1997 Aug 15 6 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control TDA7052B handbook, halfpage 10 MBH368 MBH369 handbook, halfpage 10 THD (%) 8 (1) (2) (3) THD (%) 8 6 6 (1) 4 4 2 2 (2) 0 10-1 1 PO (W) 10 0 10-2 10-1 1 10 f (kHz) 102 (1) VP = 5 V; RL = 8 . (2) VP = 6 V; RL = 8 . (3) VP = 12 V; RL = 25 . PO = 0.1 W. (1) Gv(max) = 40 dB. (2) Gv(max) = 30 dB. Fig.7 Total harmonic distortion versus output power. Fig.8 Total harmonic distortion versus frequency. handbook, halfpage 2.5 PO (W) MBH370 handbook, halfpage 2.0 (2) (3) 2.5 Pd (W) MBH371 2.0 1.5 1.5 (1) 1.0 1.0 (1) (2) (3) 0.5 0.5 0 0 4 8 12 16 VP (V) 20 0 0 4 8 12 16 VP (V) 20 Measured at a THD of 10%. The maximum output power is limited by the maximum power dissipation and the maximum available output current. (1) RL = 8 . (2) RL = 16 . (3) RL = 25 . (1) RL = 8 . (2) RL = 16 . (3) RL = 25 . Fig.9 Output power versus supply voltage. Fig.10 Total worst case power dissipation versus supply voltage. 1997 Aug 15 7 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control TDA7052B handbook, halfpage -20 MBH374 SVRR (dB) -30 (1) handbook, halfpage 2.0 VI (V) MBH375 1.6 -40 1.2 -50 (2) 0.8 -60 0.4 -70 10-2 10-1 1 10 f (kHz) 102 0 0 4 8 12 16 VP (V) 20 Measured with VR = 0.2 V. (1) VDC = 1.4 V. (2) VDC = 0.4 V. Measured at a THD of 1% and a voltage gain of 0 dB. Fig.11 Supply voltage ripple rejection versus frequency. Fig.12 Input signal handling. QUALITY SPECIFICATION In accordance with "SNW-FQ-611E", if this type is used as an audio amplifier. 1997 Aug 15 8 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control TEST AND APPLICATION INFORMATION TDA7052B (1) handbook, full pagewidth VP = 6 V 100 nF 220 F 1 n.c. 7 TDA7052B TDA7052BT 0.47 F I+i 5 + input 2 4 RL = 8 I -i RS 5 k 8 - STABILIZER TEMPERATURE PROTECTION DC volume control 3 6 MSA706 - 2 ground To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as possible to the IC. (1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 1. Fig.13 Test and application diagram. For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit protection (MCL) will be activated. 1997 Aug 15 9 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control TDA7052B handbook, halfpage handbook, halfpage VP = 6 V 56 k 4 volume control 4 volume control 1 F 1 M 1 F MCD387 MBH360 22 k Fig.14 Application with potentiometer as volume control; maximum gain = 34 dB. Fig.15 Application with potentiometer as volume control; maximum gain = 40 dB. 1997 Aug 15 10 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) TDA7052B SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 1997 Aug 15 11 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control SO8: plastic small outline package; 8 leads; body width 3.9 mm TDA7052B SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 0.010 0.057 0.069 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 0.028 0.004 0.012 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 1997 Aug 15 12 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. TDA7052B Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1997 Aug 15 13 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA7052B This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Aug 15 14 Philips Semiconductors Product specification Mono BTL audio amplifier with DC volume control NOTES TDA7052B 1997 Aug 15 15 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997 Internet: http://www.semiconductors.philips.com SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547027/1200/03/pp16 Date of release: 1997 Aug 15 Document order number: 9397 750 02729 |
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